cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 1/1 ESRN03B01S2 cystek product specification surface mount transient voltage suppressors peak pulse power 350w ESRN03B01S2 features ? bidirectional unit ? replacement for mlv (0805) ? 350w peak pulse power capability per line with a 8/20 s waveform ? low clamping voltage ? protects one power or i/o port ? ultra low capacitance ? pb-free lead plating and halogen-free package ? low leakage current ? transient protection for data line to iec61000-4-2 (esd) 15kv(air) 8kv (contact) mechanical data ? case : sod-323, molded plastic ? terminals: pure tin plated, solderable per mil-std-750 method 2026 ? mounting position : any ? epoxy: ul 94v-0 rate flame retardant equivalent circuit outline ESRN03B01S2 sod-323 ordering information device package shipping ESRN03B01S2-0-t1-g sod-323 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pcs / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 2/2 ESRN03B01S2 cystek product specification maximum ratings and characteristics (t a =25 c, unless otherwise noted ) parameter symbol value unit peak pulse power dissipation with a 8/20 s waveform (note 1) p pp 350 w esd voltage (hbm waveform per ie c61000-4-2) v esd 30 kv peak forward surge current, 8.3ms single half sine wave uni-directional only (note 2) i fsm 6 a typical thermal resistance, junction to ambient air (note 3) r thja 500 typical thermal resistance, junction to case r thjc 300 c /w power dissipation p d 0.25 w operating junction and storage temperature range t j ;t stg -55 ~ +150 c notes: 1. non-repetitive current pulse, pe r fig. 5 and derated above t a =25c per fig. 1. 2. mounted on 8.3ms single half sine-w ave or equivalent square wave, dut y cycle=4 pulses pe r minute maximum. 3. mounted on pcb with 10mm x 10 mm x 2mm cu pads to each terminal. electrical characteristics ratings at 25 ambient temperature, unless otherwise noted. characteristic symbol condition min. typ max. unit reverse stand-off voltage v rwm - - 3 reverse breakdown voltage v br i t =1ma 3.3 3.8 4.5 v reverse leakage current i r v rwm =3v - - 1 a i pp =1a, tp=8/20 s - - 6.5 i pp =3a, tp=8/20 s - - 8.5 clamping voltage v c i pp =8a, tp=8/20 s - - 13.9 v junction capacitance cj v r =0v, f=1mhz - 1.6 3 pf recommended footprint mm inch
cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 3/3 ESRN03B01S2 cystek product specification typical characteristics typical breakdown voltage vs temperature 3 3.2 3.4 3.6 3.8 4 4.2 4.4 4.6 4.8 5 -50 0 50 100 150 temperature ( ) breakdown voltage v br (v) i t =1ma pin1 to pin 2 or pin2 to pin1 typical leakage current vs temperature 0 50 100 150 200 -50 0 50 100 150 temperature ( ) leakage current i r (ua) v r =3v pin1 to pin 2 or pin2 to pin1 typical leakage current vs reverse voltage 0 1000 2000 3000 4000 5000 6000 0123456 reverse voltage v r (v) leakage current i r ( a) t a =25 pin1 to pin 2 or pin2 to pin1 typical capacitance vs reverse voltage 0 10 20 30 40 00.511.522.53 reverse voltage v r (v) capacitance (pf) t a =25 , f=1mhz pin1 to pin 2 or pin2 to pin1 typical clamping voltage vs peak pulse current 0 5 10 15 20 25 0 6 12 18 24 peak pulse current-i pp (a) clamping voltage-vc(v) t a =25 waveform parameters tr=8 s;td=20 s power derating curve 0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 ambient temperature-t a (c) percentage of rated power or i pp (%) t a =25 waveform parameters tr=8 s;td=20 s
cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 4/4 ESRN03B01S2 cystek product specification typical characteristics(cont.) non-repetitive peak pulse power vs pulse time 10 100 1000 10000 0.1 1 10 100 1000 pulse time-t p ( s) peak pulse power-p pp (w) non-repetitive peak pulse power vs pulse time 0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 25 30 time( s) percent of i pp (%) waveform parameters : tr=8 s, td=20 s e td=i pp /2 -t
cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 5/5 ESRN03B01S2 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 6/6 ESRN03B01S2 cystek product specification recommended wave soldering profile
cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 7/7 ESRN03B01S2 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c182s2 issued date : 2016.07.29 revised date : page no. : 8/8 ESRN03B01S2 cystek product specification sod-323 dimension marking: 3c 2-lead sod-323 plastic surface mounted package, cystek package code: s2 *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0630 0.0709 1.60 1.80 e 0.0060 ref 0.15 ref b 0.0453 0.0531 1.15 1.35 h 0.0000 0.0040 0.00 0.10 c 0.0315 0.0394 0.80 1.00 j 0.0035 0.0070 0.089 0.177 d 0.0098 0.0157 0.25 0.40 k 0.0906 0.1063 2.30 2.70 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with packing specification or packing method, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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